光電及半導體製程用保護液
光電玻璃材料及半導體後段封裝雷射電漿切割製程中表面保護液
Semiconductor Assembly Process by Laser Plasma Dicing (Laser Grooving)
- Easy to coat on the wafer substrate
- Low temp baking and easy-dry materials
- Transparent material
- Easy to remove by water after process
- No debirs/partticle/burn mark after removal
Optical Transmission and Condutive Coating Material
- Screen Pritning or Roller Coating on the glass substrate
- Low temp baking materials
- Transparent materials
- Easy to remove by hot water after process