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雷射劃線,雷射切割及電漿蝕刻切割製程用保護液3
https://www.pmtc2022.com/ 隆豐材料科技股份有限公司
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雷射劃線,雷射切割及電漿蝕刻切割製程用保護液

光電玻璃材料及半導體後段封裝雷射電漿切割製程中表面保護液






















Laser Scribing, Laser Dicing & Plasma Dicing Process at Semiconductor / LED Application 
  • Easy to coat on the wafer/material substrate
  • Low temp baking and easy-dry materials 
  • Transparent material 
  • Easy to remove by water after process
  • No debirs/partticle/burn mark after removal 


Water Base Optical Transmission and Condutive Coating Material
  • Screen Printing, Spraying or Roller Coating on the glass substrate
  • Low temp baking materials
  • Transparent materials
  • Easy to remove by hot water after process
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